Packaging die preparation

Details Packaging die preparation Packaging die preparation

1998-02-23

2000-12-19

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having a perfecting coating

438459, H01L 21301

Patent

active

061627038

ABSTRACT:
The present invention relates to a process for preparing a wafer for chip packaging that minimizes stress and torque on wafer components during back grinding. The wafer has fabricated thereon a plurality of dies in a die side thereof opposite a back side thereof. A protective coating is spun on the die side to protect the dies. The wafer is separated into a plurality of connected pieces by scratching or cutting a recess into streets or scribe lines in the die side. The connected pieces of the wafer are secured to a surface with the back side thereof exposed. Material is removed from the back side of the wafer by chemical, mechanical, or chemical-mechanical methods until each piece is separated or disconnected from the other pieces. The protective coating is removed. The pieces can be situated upon a flexible surface that is stretched to increase the separation between pieces. Each die in the die side of each piece is then packaged into a die package.

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Yoshiko Hara., "Toshiba Develops Paper-Thin Package," Semiconductor News, Jun. 2, 1999, pp. 1-3.
Van Zant, et al., "The Chip Packaging Manual," Semiconductor Services, 1987 pp. 4-8, 18-21.

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