Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2006-05-18
2009-06-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S724000, C257S698000, C257S704000, C257SE23193
Reexamination Certificate
active
07541662
ABSTRACT:
A packaging chip having inductors therein is provided. The packaging chip includes a substrate for mounting a circuit element therein, at least one port formed on a surface of the substrate, a sealing portion electrically connected on the substrate to the circuit element and the at least one port, respectively, and a packaging substrate bonded to the substrate through the sealing portion and packaging the circuit element. In this case, the sealing portion has a certain magnitude of inductance since it is formed of a conductive material, thereby serving as an inductor. Accordingly, the packaging chip having an inductor therein can be implemented in a small size.
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Kim Duck-hwan
Nam Kuang-woo
Park Yun-kwon
Sim Dong-ha
Song In-sang
Parekh Nitin
Samsung Electronics Co,. Ltd.
Sughrue & Mion, PLLC
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