Packaging assembly and method of assembling the same

Details Packaging assembly and method of assembling the same Packaging assembly and method of assembling the same

2007-05-08

2007-05-08

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S612000, C257S778000, C257S779000, C257S780000

Reexamination Certificate

active

10902055

ABSTRACT:
A packaging assembly includes a substrate; chip-site lands disposed on the first surface; first solder balls connected to the chip-site lands; second solder balls connected to the first solder balls including solder materials having higher melting temperatures than the first solder balls; a semiconductor chip having a plurality of bonding pads connected to the second solder balls on a surface of the semiconductor chip; and an underfill resin disposed around the first and second solder balls.

REFERENCES:
patent: 2002/0149117 (2002-10-01), Shibata
patent: 2004/0155358 (2004-08-01), Iijima
patent: 8-064717 (1996-03-01), None
patent: 10-294337 (1998-11-01), None
patent: 10-321755 (1998-12-01), None
patent: 2000-082716 (2000-03-01), None
patent: 2001-298051 (2001-10-01), None
patent: 2002-016211 (2002-01-01), None
patent: 2002-241469 (2002-08-01), None
patent: WO 02/44241 (2002-06-01), None
Notice of Grounds for Rejection issued by the Japanese Patent Office on Aug. 17, 2005, for Japanese Application No. 2003-170905, and English-language translation thereof.

Affiliated with

Also associated with

Rating

Packaging assembly and method of assembling the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging assembly and method of assembling the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging assembly and method of assembling the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3728039