Packaging architecture for a highly parallel multiprocessor syst

Details Packaging architecture for a highly parallel multiprocessor syst Packaging architecture for a highly parallel multiprocessor syst

1990-06-11

1993-10-05

Reynolds, Bruce A.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361700, 361694, 361707, H02B 120, H05K 720

Patent

active

052510972

ABSTRACT:
The present invention includes methods and apparatus for creating a packaging architecture for a highly parallel multiprocessor system. The packaging architecture of the present invention can provide for distribution of power, cooling and interconnections at all levels of components in a highly parallel multiprocessor system, while maximizing the number of circuits per unit time within certain operational constraints of such a multiprocessor system.

REFERENCES:
patent: 4964035 (1990-10-01), Aoyama et al.
patent: 5006961 (1991-04-01), Monico
patent: 5148527 (1992-09-01), Basso et al.

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