Packaging apparatus for optical interconnection on optical...

Optical waveguides – Integrated optical circuit

Reexamination Certificate

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Details

C385S032000, C385S049000, C385S088000

Reexamination Certificate

active

10795612

ABSTRACT:
A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

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patent: 2003/0185484 (2003-10-01), Chakravorty et al.
patent: 20030007311 (2003-01-01), None

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