Packaged semiconductor pressure sensor including lead supports w

Details Packaged semiconductor pressure sensor including lead supports w Packaged semiconductor pressure sensor including lead supports w

1994-02-03

1995-08-22

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257710, 73754, H01L 2312

Patent

active

054442869

ABSTRACT:
A semiconductor pressure sensor has a package base provided with an adhesive supporting portion for supporting nearly the entire lengths of inner portions of outer leads. Since nearly the entire lengths of the inner portions in a package are supported, the inner portions do not resonate even if the semiconductor pressure sensor vibrates, thereby preventing detachment of the wires bonded to the ends of the inner portions.

REFERENCES:
patent: 4651192 (1987-03-01), Matsushita et al.
patent: 4780572 (1988-10-01), Kondo et al.
patent: 5302852 (1994-04-01), Kaneda et al.

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