Packaged semiconductor device with dual exposed surfaces and...

Details Packaged semiconductor device with dual exposed surfaces and... Packaged semiconductor device with dual exposed surfaces and...

2009-07-09

2010-10-19

Clark, Jasmine J (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S015000, C438S026000, C438S051000, C438S064000, C438S111000, C438S112000, C438S123000, C438S127000

Reexamination Certificate

active

07816178

ABSTRACT:
The invention claimed is a packaged semiconductor device with dual exposed surfaces and a method of manufacturing the device. A thermal clip and one or multiple source pads are exposed on opposite ends of the device through a nonconductive molding material used to package the device. The thermal clip and source pad can be either top or bottom-exposed. The gate, source and drain leads are exposed through the molding material, and all leads are coplanar with the bottom-exposed surface. The device can have multiple semiconductor dies or various sized dies while still having a single, constant footprint. The method of manufacturing requires attaching the semiconductor die to a thermal clip, and then attaching the die with the attached thermal clip to a lead frame. The resulting device is then molded, marked, trimmed and singulated, in this order, creating a packaged semiconductor device with dual exposed surfaces.

REFERENCES:
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International Searching Authority: International Search Report and Written Opinion, mailed Apr. 1, 2008 in PCT/US06/62695 (12 pages).

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