4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. With heat sink means

David Corisis

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active

Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Heat sink for microchip application

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Heat sink for microchip application

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing
Reexamination Certificate

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Interconnect for packaging semiconductor dice and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Interconnect for packaging semiconductor dice and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-587518

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