Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-09-20
2005-09-20
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S707000, C257S788000, C257S789000
Reexamination Certificate
active
06946742
ABSTRACT:
A packaged microchip has a stress sensitive microchip, a package having a package modulus of elasticity, and an isolator between the microchip and the package. The isolator has an isolator modulus of elasticity that has a relationship with the package modulus of elasticity. This relationship causes no more than a negligible thermal stress to be transmitted to the microchip.
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Analog Devices Inc.
Bromberg & Sunstein LLP
Nguyen Dao H.
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