Packaged integrated processor and spatial light modulator

Details Packaged integrated processor and spatial light modulator Packaged integrated processor and spatial light modulator

1999-09-30

2000-11-28

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257698, 257724, 257738, H01L 2302, H01L 2304, H01L 2334, H01L 2348, H01L 2352

Patent

active

061539279

ABSTRACT:
An integrated circuit die may have a processor and a spatial light modulator formed in the same die. An opening may be provided in an interposer to allow light to reach the spatial light modulator. A plurality of bump bonds may space the interposer from the die region including the processor. Thus, a display may be formed in an integrated fashion with a processor.

REFERENCES:
patent: 5851605 (1998-12-01), Hisamitsu et al.
patent: 6069674 (2000-05-01), Aomori et al.
patent: 6075580 (2000-06-01), Kouchi

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