Packaged integrated circuit with encapsulated electronic devices

Details Packaged integrated circuit with encapsulated electronic devices Packaged integrated circuit with encapsulated electronic devices

1990-01-26

1992-05-19

James, Andrew J.

357 72, 357 74, 357 75, H01L 2348, H01L 2328, H01L 2302, H01L 2316

Patent

active

051152983

ABSTRACT:
An integrated circuit device is disclosed. The device includes a first leadframe power supply bus and a second leadframe power supply bus that each have portions separate from and adjacent to one another that lie between a first plurality of leadfingers and a second plurality of leadfingers. An electronic device is connected to the first leadframe power supply bus and to the second leadframe power supply bus. Another electronic device can be connected to the first leadframe power supply bus and to the second leadframe bus. Exemplary of the electronic devices are a de-coupling capacitor and a capacitor for high frequency noise suppression. A semiconductor die is attached to the power supply busses. A substance encapsulates the components so that an integrated semiconductor chip is formed. A method of making an integrated circuit device is also disclosed.

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W. Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1-Mbit DRAM Chip by Area Wire Bond Techniques", IEEE, 1988, pp. 552-557.

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