Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1986-09-22
1987-05-05
James, Andrew J.
Electricity: conductors and insulators
Feedthrough or bushing
Compression
357 68, 174 52FP, H01L 2348, H01L 2350
Patent
active
046636501
ABSTRACT:
An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.
REFERENCES:
patent: 3714370 (1973-01-01), Nixen et al.
patent: 3778685 (1973-12-01), Kennedy
patent: 3909838 (1975-09-01), Beyerlein
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4499333 (1983-02-01), Chee et al.
Gilder, Jr. Thomas G.
O'Dean Raymond D.
Clark S. V.
GTE Products Corporation
James Andrew J.
McNeill William H.
Theodosopoulos James
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