Segmented lead frame strip for IC chip carrier

Electricity: conductors and insulators – Feedthrough or bushing – Compression

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357 68, 174 52FP, H01L 2348, H01L 2350

Patent

active

046636510

ABSTRACT:
A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.

REFERENCES:
patent: 4109096 (1978-08-01), Dehaine
patent: 4234666 (1980-11-01), Gursky
patent: 4496965 (1985-01-01), Orcutt et al.

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