Packaged electronic device having metal comprising...

Details Packaged electronic device having metal comprising... Packaged electronic device having metal comprising...

2011-07-05

2011-07-05

Cao, Phat X (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S783000, C257SE23010

Reexamination Certificate

active

07972905

ABSTRACT:
A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive precursor includes metal particles, a first plurality of first microcapsules having a polymerizable material inside, and a second plurality of second microcapsules having a polymerization agent inside to form a first polymer upon rupture of first and second microcapsules. A force sufficient to rupture at least a portion of the first plurality of first microcapsules and at least a portion of the second plurality of second microcapsules is applied to form a self-healing die attach adhesive wherein the first polymer binds the plurality of metal particles and the remaining microcapsules and secures the IC die to the top surface of the workpiece. The self-healing die attach adhesive generally includes at least 90 vol. % metal.

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patent: 6518330 (2003-02-01), White et al.
patent: 6531340 (2003-03-01), Jiang
patent: 7108914 (2006-09-01), Skipor et al.
patent: 2004/0234763 (2004-11-01), Saito
Adee, S. “Self Healing Hulls,” [online] IEEE Spectrum [retrieved on Dec. 8, 2008], retrieved from the Internet: <http://www.spectrum.ieee.org/print/6913>.

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