Package system incorporating a flip-chip assembly

Details Package system incorporating a flip-chip assembly Package system incorporating a flip-chip assembly

2008-05-16

2010-12-28

Hoang, Quoc D (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C438S108000, C257SE23015, C257SE23020, C257SE23037

Reexamination Certificate

active

07859120

ABSTRACT:
A package system including providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a package substrate with a contact pad, a test connection, a z-bond pad, and a die receptacle, with the first semiconductor die in the flip-chip assembly fitting inside the die receptacle.

REFERENCES:
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 6815829 (2004-11-01), Shibata
patent: 6825567 (2004-11-01), Wang et al.
patent: 6921968 (2005-07-01), Chung
patent: 7045887 (2006-05-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7196416 (2007-03-01), Hochstenbach et al.

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