Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2011-07-05
2011-07-05
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S678000, C257S698000, C257SE21505, C257SE21192, C257S432000, C257S433000, C257S434000, C257S444000
Reexamination Certificate
active
07973397
ABSTRACT:
A packaging substrate having a semiconductor chip embedded and a fabrication method thereof are provided. The method includes forming a semiconductor chip in a through cavity of a core board and exposing a photosensitive portion of the semiconductor chip from the through cavity; sequentially forming a first dielectric layer and a first circuit layer on the core board, the first circuit layer being electrically connected to the electrode pads of the semiconductor chip; forming a light-permeable window on the first dielectric layer to expose the photosensitive portion of the semiconductor chip and adhering a light-permeable layer onto the light-permeable window, thereby permitting light to penetrate through the light-permeable layer to reach the photosensitive portion. Therefore, when fabricated with the method, the packaging substrate dispenses with conductive wires and dams and thus can be downsized.
REFERENCES:
patent: 5081347 (1992-01-01), Matsumoto
patent: 7282788 (2007-10-01), Chen
patent: 2008/0191335 (2008-08-01), Yang et al.
patent: 2009/0026558 (2009-01-01), Bauer et al.
Chia Kan-Jung
Hsu Shin-Ping
Clark Jasmine J
Corless Peter F.
Edwards Angell Palmer & & Dodge LLP
Jensen Steven M.
Unimicron Technology Corp.
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