Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-11-22
2005-11-22
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C438S122000
Reexamination Certificate
active
06967403
ABSTRACT:
A package structure with a heat spreader and manufacturing method thereof is disclosed. The package structure includes a substrate, a ground pad, a heat spreader, a non-conductive adhesive layer, and a pre-solder layer. A die is seated on the substrate, and the ground pad is disposed on the surface of the substrate. The manufacturing method of the package structure includes the following steps: (a) providing the substrate; (b) forming the pre-solder layer on the ground pad by solder paste printing; (c) forming the non-conductive adhesive layer on the substrate surface for being adjacent to the pre-solder layer by adhesive dispensing; (d) disposing the heat spreader onto the non-conductive layer and the pre-solder layer; and (e) heating the non-conductive adhesive layer for solidification and continuing to heat the pre-solder layer for solder reflow so that the heat spreader is adhered to the substrate via the non-conductive adhesive layer and coupled to the ground pad via the pre-solder layer.
REFERENCES:
patent: 6472743 (2002-10-01), Huang et al.
patent: 6538319 (2003-03-01), Terui
patent: 6740959 (2004-05-01), Alcoe et al.
Chiu Chi-Hao
Chuang Chi-Ta
Liu Chien
Pao Chih-Min
Advanced Semiconductor Engineering Inc.
Hoang Quoc
Nelms David
Thomas Kayden Horstemeyer & Risley
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