Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-04-16
1994-03-01
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257707, 257709, 257717, H01L 2302, H01L 2504, H01L 2312, H01L 3902
Patent
active
052910644
ABSTRACT:
A packaged semiconductor device has a wiring substrate. A plurality of semiconductor device chips are connected to the wiring substrate by a use of bumps. A heat sink is bonded through a high heat conductive bonding layer to a surface of each of the semiconductor device chips. In addition, a package casing which accommodates the semiconductor device chips and the wiring substrate, has internal conductors which are positioned in the inside of the package casing. External connection pins extend outwardly from the package casing and are connected to corresponding internal conductors. The wiring substrate is connected to the internal conductors of the package casing via a flexible wiring circuit member. The flexibility of this wiring permits the thermal expansion and contraction to occur without breaking the connections to the bumps.
REFERENCES:
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4612601 (1986-09-01), Watari
patent: 4748538 (1988-05-01), Tsuji
James Andrew J.
Jr. Carl Whitehead
NEC Corporation
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