Package structure for connection with output/input module

Details Package structure for connection with output/input module Package structure for connection with output/input module

2011-05-17

2011-05-17

Semenenko, Yuriy (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

07944707

ABSTRACT:
A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method.

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