Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-07
2008-09-02
Reichard, Dean A. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S790000, C257S686000, C257S723000, C438S108000, C438S109000
Reexamination Certificate
active
07420814
ABSTRACT:
A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate. The first and the second packages may be stacked so that the active surface of the second IC may face and be electrically connected to a major surface of the first circuit substrate.
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Jeon Jong-Keun
Kim Heui-Seog
Kim Jae-Hong
Sin Wha-Su
Harness & Dickey & Pierce P.L.C.
Levi Dameon E.
Reichard Dean A.
Samsung Electronics Co,. Ltd.
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