Package routing of integrated circuit signals

Details Package routing of integrated circuit signals Package routing of integrated circuit signals

1998-08-31

2000-12-12

Lintz, Paul R.

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

716 13, G06F 1750

Patent

active

061612154

ABSTRACT:
Signal delay and skew within an integrated circuit are minimized when 1) signals are distributed to distant points of an integrated circuit via a layer of its package, and 2) traces in the package layer are etched and treated as transmission lines. As disclosed herein, a signal is driven through a first connection between an integrated circuit and an integrated circuit package layer. The signal is then distributed to one or more additional connections between the integrated circuit and the integrated circuit package layer, by means of point-to-point transmission lines formed in the integrated circuit package layer, each of the transmission lines being terminated at one or both ends by impedances which are substantially matched to the characteristic impedance of the transmission line to which they are attached. The signal is then received into the integrated circuit through the one or more additional connections between the integrated circuit and the integrated circuit package layer.

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