Package-on-package system

Details Package-on-package system Package-on-package system

2006-06-14

2009-06-23

Ngo, Hung V (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C257S686000, C257S738000, C257S777000

Reexamination Certificate

active

07550680

ABSTRACT:
A package-on-package system is provided with a base package. Solder caps are provided on the top of the base package. The solder caps are configured to protrude above subsequent resin bleed, and are configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.

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