Package, in particular for MEMS devices and method of making...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Details

C438S125000, C257S415000, C257S698000, C257SE23190, C257SE29324

Reexamination Certificate

active

07998774

ABSTRACT:
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.

REFERENCES:
patent: 6624003 (2003-09-01), Rice
patent: 2001/0007733 (2001-07-01), Matsuyama et al.
patent: 2002/0054422 (2002-05-01), Carr et al.
patent: 2003/0059976 (2003-03-01), Nathan et al.
patent: 2005/0120553 (2005-06-01), Brown et al.
patent: 2005/0263841 (2005-12-01), Fincato
patent: 2006/0086899 (2006-04-01), Chao et al.
patent: 2006/0128058 (2006-06-01), Dungan et al.
patent: 2006/0148137 (2006-07-01), Hartzell et al.
patent: 2008/0164543 (2008-07-01), Ziglioli et al.
patent: 2008/0179697 (2008-07-01), Cortese et al.
patent: 1775259 (2005-10-01), None
patent: 1945561 (2008-07-01), None

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