Package, in particular for MEMS devices and method of making...

Details Package, in particular for MEMS devices and method of making... Package, in particular for MEMS devices and method of making...

2011-08-16

2011-08-16

Valentine, Jami M (Department: 2894)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S125000, C257S415000, C257S698000, C257SE23190, C257SE29324

Reexamination Certificate

active

07998774

ABSTRACT:
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the passing opening. A protective package incorporates the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device exposed through the passing opening of the substrate.

REFERENCES:
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patent: 1775259 (2005-10-01), None
patent: 1945561 (2008-07-01), None

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