Package for semiconductor acceleration sensor

Details Package for semiconductor acceleration sensor Package for semiconductor acceleration sensor

2006-06-29

2009-11-10

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S701000, C257SE21500, C257SE23190

Reexamination Certificate

active

07615835

ABSTRACT:
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face of the board in order to fix the board to a first face of the cavity, the second region being a region on the board other than the region thereof underneath the first region.

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patent: 7005732 (2006-02-01), Horning et al.
patent: 2004/0232507 (2004-11-01), Furukubo et al.
patent: 2005/0062067 (2005-03-01), Kunda et al.
patent: 2006/0219006 (2006-10-01), Nasiri et al.
patent: 6-160423 (1994-06-01), None
patent: 6-289048 (1994-10-01), None

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