Package for power semiconductor chips

Details Package for power semiconductor chips Package for power semiconductor chips

1997-08-05

1999-05-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438121, H01L21/44

Patent

active

059044993

ABSTRACT:
An electronic packaging module for bonding of power semiconductor devices is produced. The semiconductor device is mounted on a base, and enclosed by a frame and lid. The lid is an insulating substrate having a conductive pattern with protuberances on the conductive pattern of the substrate. The protuberances are of a soft, ductile metal capable of being metallurgically bonded to the metallization pads of semiconductor devices. The metal protuberances are bonded to the semiconductor device joining it to the lid, and through the conductive pattern of the lid connecting the device to the input/output contacts of the package.

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