Package for high frequency waves containing high frequency...

Details Package for high frequency waves containing high frequency... Package for high frequency waves containing high frequency...

2006-08-25

2009-02-03

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Coupling networks

With impedance matching

C333S260000

Reexamination Certificate

active

07486157

ABSTRACT:
In an embodiment of the invention, a package for high frequency waves mounted by a high frequency electronic circuit comprises an hermetic box-shaped high frequency package containing a high frequency electronic circuit in the inside and shielded by a conductor, an input terminal and an output terminal partly led out to the outside of the high frequency package, an input side feed-through section having one of its opposite ends connected to the input terminal and the other end connected to the high frequency electronic circuit and having a predetermined characteristic impedance; and an output side feed-through section having one of its opposite ends connected to the output terminal and the other end connected to the high frequency electronic circuit and having a characteristic impedance lower than the characteristic impedance of the input side feed-through section as viewed from the output terminal side.

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patent: 7-94649 (1995-04-01), None
patent: WO 00/75990 (2000-12-01), None

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