Package for enclosing microoptical and/or microelectronic device

Details Package for enclosing microoptical and/or microelectronic device Package for enclosing microoptical and/or microelectronic device

1998-03-06

2000-04-25

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

257659, 257660, H01L 2334

Patent

active

060547669

ABSTRACT:
The invention relates to a package for microoptical and/or microelectronic devices. The package is to be designed in such a way that package resonances initiated by standing waves produced in the package are completely avoided or very highly attenuated. This is achieved by making the package, in whole or in part, of a microwave-absorbing, nonoutgassing material. A suitable material is silicon or graphite, for example.

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patent: 5515009 (1996-05-01), Wong et al.
patent: 5578890 (1996-11-01), Vig
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Patent Abstracts of Japan, vol. 016, No. 321 (M-1279), Jul. 14, 1992 & JP 04 091846 A (Nippon Shokubia Co Ltd), Mar. 25, 1992.
Patent Abstracts of Japan, vol. 015, No. 330 (E-1103), Aug. 22, 1991 & JP 03 124050 A (Sharp Corp) May 27, 1991.
Bierman, H: "Microwave Packages are Meeting GAAS Challenges", Microwave Journal, Bd. NR 11, Nov. 1, 1986, pp. 26, 28, 31/32, 34.
Yook J--G et al, "Experimental and Theoretical Study of Parasitic Leakage/Resonance in a K/KA-Band MMIC Package" IEEE Trans Microwave Theory, 1, Dec. 1996,pp. 2403-2409.
NI T-D et al: "High Frequency Hermetic Packages Using LTCC" 1996 IEEE MIT-S Int'l Symp. San Francisco, Jun. 17-21, 1996, pp. 1627-1630.
Patent Abstracts of Japan, vol. 097, No. 009, Sep. 30, 1997, & JP 09 116301 A (NEC Corp), May 2, 1997.

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