Package for a micro-electro mechanical device

Details Package for a micro-electro mechanical device Package for a micro-electro mechanical device

2004-02-09

2008-12-16

Menz, Douglas M (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S106000, C257S682000, C257SE23095

Reexamination Certificate

active

07465600

ABSTRACT:
A package for a micro-electromechanical device (MEMS package) includes an inner enclosure having an inner cavity defined therein, and a fill port channel communicating with the inner cavity and of sufficient length to allow a quantity of adhesive to enter the fill port channel while preventing the adhesive from entering the inner cavity.

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