Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-03-15
2010-11-02
Rossoshek, Helen (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000, C716S030000, C716S030000, C714S010000, C714S025000, C714S036000, C714S741000, C714S742000
Reexamination Certificate
active
07827515
ABSTRACT:
A method including obtaining an operational status of a first processor core, where the first processor core is associated with a plurality of processor cores located on a chip; configuring a first IO block of a package design based on the operational status of the first processor core, where the package design is based on a fully functional chip; and configuring a stackup of the package design after configuring the first IO block for use with the chip.
REFERENCES:
patent: 5331591 (1994-07-01), Clifton
patent: 5937202 (1999-08-01), Crosetto
patent: 6028365 (2000-02-01), Akram et al.
patent: 6081463 (2000-06-01), Shaffer et al.
patent: 6728862 (2004-04-01), Wilson
patent: 6894513 (2005-05-01), Sen et al.
patent: 6898580 (2005-05-01), Curran et al.
patent: 7017074 (2006-03-01), Okin
patent: 7155370 (2006-12-01), Nejedlo
patent: 7171542 (2007-01-01), Alfano et al.
patent: 7194600 (2007-03-01), Douglass et al.
patent: 7299377 (2007-11-01), Norman
patent: 7328371 (2008-02-01), Kalyanasundharam et al.
patent: 7336095 (2008-02-01), Erickson et al.
patent: 7401165 (2008-07-01), Nishimoto et al.
patent: 7484153 (2009-01-01), Kiryu et al.
patent: 7519866 (2009-04-01), Crowell et al.
patent: 2005/0071719 (2005-03-01), Faust et al.
patent: 2006/0036831 (2006-02-01), Karashima et al.
patent: 2007/0260823 (2007-11-01), Dickinson et al.
patent: 2008/0320331 (2008-12-01), Nakatani et al.
patent: 2009/0193652 (2009-08-01), Salmon
Oracle America Inc.
Osha & Liang LLP
Rossoshek Helen
LandOfFree
Package designs for fully functional and partially... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Package designs for fully functional and partially..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Package designs for fully functional and partially... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4149999