P-channel trench MOSFET structure

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S331000, C257S341000, C257S342000

Reexamination Certificate

active

07462910

ABSTRACT:
A low voltage P-channel power MOSFET using trench technology has an epitaxially deposited constant concentration N channel region adjacent the side walls of a plurality of trenches. The constant concentration channel region is deposited atop a P+substrate and receives P+source regions at the tops of each trench. The source contact is connected to both source and channel regions for a unidirectional conduction device, or only to the source regions for a bidirectional device.

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A High-Density Ultra-Low Rdson 30 Volt N-Channel Trench FETs for DC/DC Converter Applications, El Segundo CA, pp. 1-4, Sodhi R; Malik R; Asselanis D; and Kinzer D, “Proceedings of International Symposium of Power Semiconductor Devices and ICs (ISPSD)”, May 26, 1999. IEEE Catalog #99CH36312, pp. 303-306.
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