Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2007-01-02
2007-01-02
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S424000, C438S436000, C438S437000, C438S706000, C438S745000, C257SE21002
Reexamination Certificate
active
10850747
ABSTRACT:
A method for cleaning and forming an oxide film on a surface, particularly a silicon surface. The surface is initially cleaned and then exposed to ozone vapor, which forms the oxide film on the surface. The method is particularly useful for forming a pre-liner oxide film on trench surfaces in the fabrication of STI (shallow trench isolation) structures.
REFERENCES:
patent: 6848455 (2005-02-01), Shrinivasan et al.
patent: 6933206 (2005-08-01), Beintner et al.
Cheng Chung-Long
Kao Jung-Hui
Thei Kong-Beng
Novacek Christy
Taiwan Semiconductor Manufacturing Co. Ltd.
Trinh Michael
Tung & Associates
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