Oxygen ion-beam microlithography

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430322, 430325, 156628, 2504923, 2504922, G03C 500

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active

050413619

ABSTRACT:
A method of providing and developing a resist on a substrate for constructing integrated circuit (IC) chips includes the following steps: of depositing a thin film of amorphous silicon or hydrogenated amorphous silicon on the substrate and exposing portions of the amorphous silicon to low-energy oxygen ion beams to oxidize the amorphous silicon at those selected portions. The nonoxidized portions are then removed by etching with RF-excited hydrogen plasma. Components of the IC chip can then be constructed through the removed portions of the resist. The entire process can be performed in an in-line vacuum production system having several vacuum chambers. Nitrogen or carbon ion beams can also be used.

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Joseph Grenier, Wafer Fabrication Equipment Five Year Forecast, Solid State Technology, pp. 67-70 (1988).
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T. D. Cambria and N. P. Economou, Mask and Circuit Repair with Focused-Ion Beams, Solid State Technology, pp. 133-136 (1987).

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