Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1990-05-23
1993-03-09
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430947, 430923, 522 66, 522 29, 502152, 502156, 502155, 556 53, 556 11, 544 4, 544 64, 544225, 546 2, 546 4, 546 11, 546 12, 549 3, 549206, G03F 7029, C07F 1700
Patent
active
051926423
ABSTRACT:
Titanocenes of the formula I ##STR1## in which R.sup.1 are cyclopentadienyl.sup..crclbar. groups and R.sup.2 and R.sup.3 are aromatic radicals which are substituted in both ortho-positions by fluorine and, in addition, are substituted by an acyloxy group are suitable as photoinitiators for the photopolymerization of ethylenically unsaturated compounds.
REFERENCES:
patent: 4590287 (1986-05-01), Riediker et al.
patent: 4713401 (1987-12-01), Riediker et al.
patent: 4857654 (1989-08-01), Riediker et al.
patent: 4963470 (1990-10-01), Klingert et al.
patent: 5008302 (1991-04-01), Husler et al.
patent: 5026625 (1991-06-01), Riediker et al.
patent: 5055372 (1991-10-01), Shanklin et al.
M. A. Chaudhari et al., J. Organomet. Chem., 2, 206 (1964).
C. Tamborski et al., J. Organomet. Chem., 4, 445 (1965).
Beyeler Harry
Desobry Vincent
Dietliker Kurt
Husler Rinaldo
Riediker Martin
Ciba-Geigy Corporation
Hall Luther A. R.
McCamish Marion E.
RoDee C. D.
Teoli, Jr. William A.
LandOfFree
Oxygen-containing titanocenes, and the use thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Oxygen-containing titanocenes, and the use thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oxygen-containing titanocenes, and the use thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-210455