Oxide semiconductor, thin-film transistor and method for...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S197000, C438S513000, C257SE21051, C257SE21077, C257SE21081, C257SE21311, C257SE21400, C257SE21411

Reexamination Certificate

active

07807515

ABSTRACT:
Disclosed is an oxide semiconductor having an amorphous structure, wherein higher mobility and reduced carrier concentration are achieved. Also disclosed are a thin film transistor, a method for producing the oxide semiconductor, and a method for producing the thin film transistor. Specifically disclosed is an oxide semiconductor which is characterized by being composed of an amorphous oxide represented by the following a general formula: Inx+1MZny+1SnzO(4+1.5x+y+2z)(wherein M is Ga or Al, 0≦x≦1, −0.2≦y≦1.2, z≧0.4 and 0.5≦(x+y)/z≦3). This oxide semiconductor is preferably subjected to a heat treatment in an oxidizing gas atmosphere after film formation. Also specifically disclosed is a thin film transistor which is characterized by comprising the oxide semiconductor.

REFERENCES:
patent: 6750352 (2004-06-01), Ono et al.
patent: 2008/0050581 (2008-02-01), Miwa et al.
patent: 2000-044236 (2000-02-01), None
patent: 2006-013433 (2006-01-01), None
patent: 2007-123699 (2007-05-01), None
patent: 2007-142196 (2007-06-01), None
Nature/vol. 432, published on Nov. 25, 2004, pp. 488-492, “Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors” by Kenji Nomura, Hiromichi Ohta, Akihiro Takagi, Toshiko Kamiya, Masahiro Hirano, and Hideo Hosono.

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