Oxide-free extruded thermal joint

Details Oxide-free extruded thermal joint Oxide-free extruded thermal joint

1986-05-09

1987-08-11

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

72360, B23K 3102

Patent

active

046856064

ABSTRACT:
A method of joining a thermally conductive element to an electric circuit chip for cooling the chip includes initial steps of forming an oxide-free preform of a fusible metal alloy by extrusion of alloy between two mold blocks or plates. During the extrusion, the oxide coating is left behind so that the extruded alloy is essentially free of oxide. The extrusion takes place at a temperature elevated to approximately the liquidus temperature of the alloy. The preform, which may be in the form of a pill or section of thin foil, is placed between interfacing surfaces of the thermally conductive element and the chip, and is then extruded along the interfacing surfaces under pressure and elevated temperature to form a thermally conductive, oxide-free bonding layer of superior thermal conductivity.

REFERENCES:
patent: 611574 (1898-09-01), Gay
patent: 13140683 (1964-07-01), Moll
patent: 3199829 (1965-09-01), Calim
patent: 4194672 (1980-03-01), Uto et al.
patent: 4483478 (1984-10-01), Schulz

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