Oxide film fabrication method and electronic device

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419216, 20419222, 20419223, 2041923, 216 22, 216 52, C23C 1434

Patent

active

060335327

ABSTRACT:
A method of forming an oxide film over the substrate of an electronic device. In one embodiment, a first metal oxide film layer is deposited on the substrate of the electronic device by bias sputtering. Then, a second metal oxide film layer is deposited by ion beam sputtering on the first metal oxide film layer. In another embodiment, a first metal oxide film layer is deposited on the substrate of the electronic device by ion beam sputtering. Then, a second metal oxide film layer is deposited by bias sputtering on the first metal oxide film layer. In yet another embodiment, a first metal oxide film layer having a first degree of purity is deposited on the substrate of the electronic device. Then, a second metal oxide film layer having a second degree of purity is deposited on the first metal oxide film layer. The first degree of purity is different than the second degree of purity.

REFERENCES:
patent: 4036723 (1977-07-01), Schwartz et al.
patent: 4142958 (1979-03-01), Wei et al.
patent: 5062937 (1991-11-01), Komuro
patent: 5225953 (1993-07-01), Wada et al.
patent: 5268217 (1993-12-01), Kimock et al.

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