Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2004-07-20
2010-02-02
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S112000, C257SE21503
Reexamination Certificate
active
07655508
ABSTRACT:
A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.
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Bolken Todd O.
Johnson Mark S.
Jones Day
Micro)n Technology, Inc.
Pencoske Edward L.
Stark Jarrett J
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