Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Reexamination Certificate
2008-05-27
2008-05-27
Toatley, Jr., Gregory J. (Department: 2877)
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
C382S151000, C438S401000, C257S797000
Reexamination Certificate
active
07379184
ABSTRACT:
In an overlay metrology method used during semiconductor device fabrication, an overlay alignment mark facilitates alignment and/or measurement of alignment error of two layers on a semiconductor wafer structure, or different exposures on the same layer. A target is small enough to be positioned within the active area of a semiconductor device combined with appropriate measurement methods, which result in improved measurement accuracy.
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Ku Yi-Sha
Pang Hsin Lan
Smith Nigel Peter
Industrial Research Technology Institute
Nanometrics Incorporated
Silicon Valley Patent & Group LLP
Stock, Jr. Gordon J.
Toatley , Jr. Gregory J.
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