Overlay measurement target

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

Reexamination Certificate

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Details

C382S151000, C438S401000, C257S797000

Reexamination Certificate

active

07379184

ABSTRACT:
In an overlay metrology method used during semiconductor device fabrication, an overlay alignment mark facilitates alignment and/or measurement of alignment error of two layers on a semiconductor wafer structure, or different exposures on the same layer. A target is small enough to be positioned within the active area of a semiconductor device combined with appropriate measurement methods, which result in improved measurement accuracy.

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