Overlapping chip replaceable subunits, methods of making same, a

Recorders – Markers and/or driving means therefor – With ink supply to marker

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 55, 357 75, 439 44, 361400, G01D 1518, H01L 2906

Patent

active

050972740

ABSTRACT:
Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support. The structure of the present invention enables extended arrays of subunits to be accurately placed on one surface of a substrate, while permitting individual subunits to be removed from the substrate easily and without damaging adjacent subunits or their electrical connections to the host machine.

REFERENCES:
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4612554 (1986-09-01), Poleshuk
patent: 4690391 (1987-09-01), Stoffel et al.
patent: 4712018 (1987-12-01), Stoffel et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4830985 (1989-05-01), Araghi et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4961821 (1990-10-01), Drake et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Overlapping chip replaceable subunits, methods of making same, a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Overlapping chip replaceable subunits, methods of making same, a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlapping chip replaceable subunits, methods of making same, a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1479494

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.