Recorders – Markers and/or driving means therefor – With ink supply to marker
Patent
1991-07-19
1992-03-17
Fuller, Benjamin R.
Recorders
Markers and/or driving means therefor
With ink supply to marker
357 55, 357 75, 439 44, 361400, G01D 1518, H01L 2906
Patent
active
050972740
ABSTRACT:
Overlapping chip replaceable subunits for RIS or ROS array bars are disclosed. The subunits include a planar semiconductive substrate having at least one component and supporting circuitry on a surface thereof. The semiconductive substrate has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The planar semiconductive substrate is mounted on a planar support which can be, for example, a daughterboard/heat sink assembly having at least one electrode having a terminal at one end thereof. The planar support also has first and second side edges, a front edge and a width equal to a distance between the first and second side edges. The width of the support is less than the width of the semiconductive substrate so that the first and second side edges of the planar semiconductive substrate extend outwardly beyond the first and second side edges, respectively, of the support. The structure of the present invention enables extended arrays of subunits to be accurately placed on one surface of a substrate, while permitting individual subunits to be removed from the substrate easily and without damaging adjacent subunits or their electrical connections to the host machine.
REFERENCES:
patent: 4601777 (1986-07-01), Hawkins et al.
patent: 4612554 (1986-09-01), Poleshuk
patent: 4690391 (1987-09-01), Stoffel et al.
patent: 4712018 (1987-12-01), Stoffel et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4830985 (1989-05-01), Araghi et al.
patent: 4851371 (1989-07-01), Fisher et al.
patent: 4961821 (1990-10-01), Drake et al.
Drake Donald J.
Hermanson Herman A.
Bobb Alrick
Fuller Benjamin R.
Xerox Corporation
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