4. Etching a substrate: processes
  5. Etching of semiconductor material to produce an article...

Herman A. Hermanson

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Apparatus for bonding wafer pairs

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Chamber enclosing work during bonding and/or assembly
Patent

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Bead bypass

Photocopying – Including fiber optics
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Bead bypass speed reduction

Photocopying – Including fiber optics
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Blade applicator assembly

Coating apparatus – Immersion or work-confined pool type – Work-confined pool
Patent

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Bubble jet printing device with improved printhead heat control

Recorders – Markers and/or driving means therefor – With ink supply to marker
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Profile ID: LFUS-PAI-P-151018

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