Overlapped stressed liners for improved contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S346000, C257S372000, C257SE21205, C257SE21008, C257S626000, C257SE21640

Reexamination Certificate

active

07612414

ABSTRACT:
A semiconductor structure is provided which includes a first semiconductor device in a first active semiconductor region and a second semiconductor device in a second active semiconductor region. A first dielectric liner overlies the first semiconductor device and a second dielectric liner overlies the second semiconductor device, with the second dielectric liner overlapping the first dielectric liner at an overlap region. The second dielectric liner has a first portion having a first thickness contacting an apex of the second gate conductor and a second portion extending from peripheral edges of the second gate conductor which has a second thickness substantially greater than the first thickness. A first conductive via contacts at least one of the first or second gate conductors and the conductive via extends through the first and second dielectric liners at the overlap region. A second conductive via may contact at least one of a source region or a drain region of the second semiconductor device.

REFERENCES:
patent: 2005/0106844 (2005-05-01), Tung et al.
patent: 2005/0260810 (2005-11-01), Cheng et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Overlapped stressed liners for improved contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Overlapped stressed liners for improved contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlapped stressed liners for improved contacts will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4053623

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.