Over-passivation process of forming polymer layer over IC chip

Details Over-passivation process of forming polymer layer over IC chip Over-passivation process of forming polymer layer over IC chip

2011-04-05

2011-04-05

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21496

Reexamination Certificate

active

07919412

ABSTRACT:
A method for forming a semiconductor chip or wafer includes following steps. A semiconductor substrate is provided, and then a polymer layer is deposited over the semiconductor substrate, wherein the polymer layer comprises polyimide. The polymer layer with a temperature profile having a peak temperature between 200 and 320 degrees Celsius. Alternatively, the temperature profile may comprises a period of time with a temperature higher than 320 degree Celsius, wherein the period of time is shorter than 45 minutes.

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