Organosiloxanes

Coating processes – Coating by vapor – gas – or smoke – Base includes an inorganic compound containing silicon or...

Reexamination Certificate

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Details

C427S489000, C427S503000, C528S031000, C528S032000, C528S043000

Reexamination Certificate

active

06962727

ABSTRACT:
The present invention provides an organosiloxane comprising at least 80 weight percent of Formula 1: [Y0.01-1.0SiO1.5-2]a{Z0.01-1.0SiO1.5-2]b[H0.01-1.0SiO1.5-2]c(where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula 1; b is from 2 percent to 50 percent of Formula 1; and c is from 20 percent to 80 percent of Formula 1. The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.

REFERENCES:
patent: 4808687 (1989-02-01), Burns
patent: 5179185 (1993-01-01), Yamamoto et al.
patent: 5494750 (1996-02-01), Fujioka et al.
patent: 5589162 (1996-12-01), Muraoka
patent: 6143855 (2000-11-01), Hacker et al.

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