Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2011-06-14
2011-06-14
Meeks, Timothy H (Department: 1715)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S250000
Reexamination Certificate
active
07959986
ABSTRACT:
This invention relates to organometallic precursor compounds represented by the formula (Cp(R′)x)yM(H)z-y, a process for producing the organometallic precursor compounds, and a method for depositing a metal and/or metal carbide layer, e.g., Ta metal and/or TaC layer, on a substrate by the thermal or plasma enhanced disassociation of the organometallic precursor compounds, e.g., by CVD or ALD techniques. The metal and/or metal carbide layer is useful as a liner or barrier layer for conducting metals and high dielectric constant materials in integrated circuit manufacturing.
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Peters David Walter
Thompson David M.
Burkhart Elizabeth
Meeks Timothy H
Praxair Technology Inc.
Schwartz Iurie A.
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