Organically modified silicic acid polycondensates,...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S281100, C430S282100, C430S283100, C430S284100, C430S285100, C430S288100, C430S286100, C430S287100, C528S394000, C528S425000, C522S099000, C522S148000

Reexamination Certificate

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06984483

ABSTRACT:
The invention relates to organically modified, stable in storage, UV curable, NIR permeable silicic acid polycondensates which are photostructurable in layers having a thickness of 1 to 150 μm. The invention also relates to the production and use thereof as negative resists. The polycondensates according to the invention are obtainable by condensation of organically modified silanediols of the formula I with organically modified silanes of the formula II.in-line-formulae description="In-line Formulae" end="lead"?Ar2Si(OH)2  (I)in-line-formulae description="In-line Formulae" end="tail"?in-line-formulae description="In-line Formulae" end="lead"?RSi(OR′)3  (II)in-line-formulae description="In-line Formulae" end="tail"?The radicals are identical or different and have the following meaning:Ar=a radical having 6 to 20 carbon atoms and at least one aromatic group,R=an organic radical having 2 to 15 carbon atoms and at least one epoxy group and/or at least one C═C double bond,R′=methyl or ethyl.Condensation occurs without the addition of water. The molar ratio of said compounds I and II is 1:1. Up to 90 mole percent of said compound of the formula II can be replaced by co-condensable compounds of boron, aluminum, silicon, germanium, titanium and zirconium.

REFERENCES:
patent: 4824875 (1989-04-01), Gutek
patent: 5292849 (1994-03-01), Fujioka et al.
patent: 196 13 650 (1997-04-01), None
patent: 0 812 894 (1997-12-01), None
Endo, Takeshi, et al., “New Acrylates and Methacrylates Bearing Pendant Spiro Ortho Ester Groups,”Journal of Polymer Science: Part C: Polymer Letters, vol. 26, pp. 517-520 (1988).

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