Organic preclean for improving vapor phase wafer etch uniformity

Details Organic preclean for improving vapor phase wafer etch uniformity Organic preclean for improving vapor phase wafer etch uniformity

1992-12-21

1998-06-09

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566531, 1566431, 134 12, H01L 21302

Patent

active

057627550

ABSTRACT:
A method for achieving greater uniformity and control in vapor phase etching of silicon, silicon oxide layers and related materials associated with wafers used for semiconductor devices comprises the steps of first cleaning the wafer surface to remove organics, followed by vapor phase etching. An integrated apparatus for cleaning organic and, subsequently, vapor phase etching, is also described.
In embodiments of the invention cooling steps are incorporated to increase throughput, an on-demand vaporizer is provided to repeatably supply vapor at other than azeotropic concentration, and a residue-free etch process is provided.

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