Optoelectronic component using two encapsulating materials...

Details Optoelectronic component using two encapsulating materials... Optoelectronic component using two encapsulating materials...

2005-03-01

2005-03-01

Abraham, Fetsum (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Charge transfer device

C257S228000, C257S787000, C257S788000, C257S789000, C257S790000, C257S791000, C257S792000, C257S793000, C257S794000, C257S795000, C438S112000, C438S124000, C438S127000

Reexamination Certificate

active

06861683

ABSTRACT:
In an optoelectronic component assembly and a method for the production thereof, the optoelectronic component assembly includes an optoelectronic component arranged on a support element, which is surrounded by a closed dam. An encapsulation is arranged in an inner area of the dam, which encapsulates the optoelectronic component and includes two sealing materials. The inner area of the dam may be filled with a first sealing material up to the top edge of the optoelectronic component. The inner area of the dam located above the optoelectronic component is filled with a second transparent sealing material at least in one area of the window.

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