4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Florian Obermayer

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Component assembly and method for producing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Optoelectronic component using two encapsulating materials...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Florian Obermayer does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Florian Obermayer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Florian Obermayer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2787520

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure