Opto-electronic hybrid integration platform, optical sub-module,

Details Opto-electronic hybrid integration platform, optical sub-module, Opto-electronic hybrid integration platform, optical sub-module,

1999-08-17

2000-12-26

Ngo, Hung N.

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

385 89, 385 14, 385132, 385 92, G02B 636

Patent

active

061648361

ABSTRACT:
An opto-electronic hybrid integrated circuit of the present invention satisfies a low-loss optical waveguide function, an optical bench function and a high-frequency electrical wiring function. The circuit includes a substrate such as a silicon substrate, a dielectric optical waveguide part arranged in a recess of the substrate, and an optical device mounting part formed on a protrusion of the substrate. An electrical wiring part is disposed on the dielectric layer. The optical device is mounted on the substrate. An optical sub-module includes the optical device which is possible to mount on the substrate.

REFERENCES:
patent: 4930857 (1990-06-01), Acarlar
patent: 5128915 (1992-07-01), Yamashita et al.
patent: 5228101 (1993-07-01), Lebby et al.
patent: 5347601 (1994-09-01), Ade et al.
patent: 5353364 (1994-10-01), Kurashima
patent: 5412748 (1995-05-01), Furuyama et al.
patent: 5416871 (1995-05-01), Takahashi et al.
patent: 5521992 (1996-05-01), Chun et al.
patent: 5892859 (1999-04-01), Grote
43rd Electronic Components & Technology Conference, Jun. 1-4, 1993, "Multichannel for Asynchronous Transfer Mode Switching Systems", Y. Arai et al., pp. 825-830.
"Hybrid-Integrated 4.times.4 Optical . . . Waveguides and LD Array Chips", by Yasufumi Yamada et al., pp. 383-390, Journal of Lightwave Technology, vol. 10, No. 3, Mar., 1992.
"Gigabit Transmitter Array Modules on Silicon Waferboard", by Craig A. Armiento et al., pp. 1072-1080; IEEE, vol. 15, No. 6, Dec., 1992.
"Silica-Based Optical Waveguide On Terraced Silicon Substrate as Hybrid Integration Platform", by Y. Yamada et al., pp. 444-445, Electronics Letters, vol. 29, No. 5, Mar. 4, 1993.
"LiNbO.sub.3 Chip Assembly On Silica-Based Waveguide On Terraced Silicon Substrate", by Yasufumi Yamada et al., pp. 204-205, LEOS '93 6th Annual Meeting, Nov. 15-18, 1993, San Jose, CA.

Affiliated with

Also associated with

Rating

Opto-electronic hybrid integration platform, optical sub-module, does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Opto-electronic hybrid integration platform, optical sub-module,, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Opto-electronic hybrid integration platform, optical sub-module, will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-987894