Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2004-05-25
2009-08-04
Neckel, Alexa D (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192330
Reexamination Certificate
active
07569123
ABSTRACT:
In one embodiment, the erosion profile of a shaped target (e.g., hollow cathode target) of a magnetron apparatus is enhanced by using a plurality of sputtering tracks, such as plasma loops, on the target. The erosion profile may be optimized by recording the erosion profile and making adjustments to the magnetic configuration of the magnetron. The recording may include two-dimensional plots of erosion/redepostion rates or a grid overlay tracing of a static burn test, for example. The magnetic configuration of the magnetron may include a rotating magnetic array. The rotating magnetic array may be adjusted to change the shape or location of the plurality of plasma loops to achieve an optimum erosion profile. The target may have a flared lip to increase erosion on the lip, if needed.
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Hayden Douglas B.
Juliano Daniel R.
Band Michael
Neckel Alexa D
Novellus Systems Inc.
Okamoto & Benedicto LLP
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